News & Insights

Technical Insights

Focused technical articles on MPW flow, PDK/NDA/GDS, package/test, P&ID, BOM context and native SOLIDWORKS assembly.

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Technical Insights

Jul 2026 Technical Insights

How to Tape Out Your First ASIC Without a Foundry Account

A practical route from entity and eligibility review through NDA, PDK, run registration, signoff, final GDS acceptance and first-silicon delivery.

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Jul 2026 Technical Insights

Where Can I Manufacture a Small Batch of Custom Chips?

Compare MPW, prototype, multi-level-mask and dedicated-wafer routes for small-batch ASICs, including process fit, delivery form, packaging and test.

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Jul 2026 Technical Insights

SECS/GEM for Legacy Equipment: Retrofit, Replay Debugging & Acceptance Checklist

A practical guide for legacy-tool retrofits and industrial OEMs entering semiconductor automation—covering equipment models, gateway mappings, replay evidence, responsibility boundaries and fab acceptance scenarios.

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Jun 2026 Technical Insights

From Prompting to Loop Engineering: Why Semiconductor AI Needs Review Loops

Loop engineering is a better frame for semiconductor AI than one-shot prompting: MPW RFQs, P&ID-to-3D assembly, BOM sourcing and manufacturing review all need repeatable,…

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Jun 2026 Technical Insights

MPW Timeline: From Outline RFQ to Shuttle Planning

MPW timeline is more than a shuttle date. Screening, NDA, PDK, partner confirmation, packaging, probe, test and logistics all affect schedule.

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Jun 2026 Technical Insights

PDK, NDA and GDS: What Happens Before MPW Tapeout?

Before MPW tapeout, teams need the right NDA and PDK path. GDS should come later, after process fit and review path are confirmed.

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Jun 2026 Technical Insights

MPW Tapeout Cost: What Drives the Quote?

MPW cost is not only about node name. Die area, process options, reticle use, packaging, probe, test and schedule all shape the quote.

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Jun 2026 Technical Insights

Where Can Overseas Teams Start a Mature-Node MPW RFQ Before Sharing GDS?

For overseas fabless, university and industrial chip teams, a mature-node MPW RFQ can start with outline requirements before GDS or design IP is shared.

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Jun 2026 Technical Insights

BOM Consolidation, Custom Drawing Parts and Export Logistics for Semiconductor Equipment RFQs

A procurement guide for combining BOM, drawing-to-order and export/logistics requirements into a structured RFQ.

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Jun 2026 Technical Insights

Obsolete Part and Alternative Sourcing for Semiconductor Equipment BOMs

How procurement and engineering teams should structure RFQs for obsolete parts, approved equivalents and BOM substitutions.

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