技術インサイト
MPW フロー、PDK/NDA/GDS、package/test、P&ID、BOM context、ネイティブ SOLIDWORKS assembly に関する技術記事。
技術インサイト
How to Tape Out Your First ASIC Without a Foundry Account
A practical route from entity and eligibility review through NDA, PDK, run registration, signoff, final GDS acceptance and first-silicon delivery.
Where Can I Manufacture a Small Batch of Custom Chips?
Compare MPW, prototype, multi-level-mask and dedicated-wafer routes for small-batch ASICs, including process fit, delivery form, packaging and test.
レガシー装置向け SECS/GEM：改造、リプレイ解析、受入チェックリスト
A practical guide for legacy-tool retrofits and industrial OEMs entering semiconductor automation—covering equipment models, gateway mappings, replay evidence, responsibility boundaries and fab acceptance scenarios.
Prompt から Loop Engineering へ: 半導体 AI にレビュー可能なループが必要な理由
Loop engineering は、MPW、P&ID-to-3D、BOM/RFQ、製造レビューに適した考え方です。半導体 AI には一回の prompt ではなく、人間が確認する反復ループが必要です。
MPW Timeline: From Outline RFQ to Shuttle Planning
MPW timeline is more than a shuttle date. Screening, NDA, PDK, partner confirmation, packaging, probe, test and logistics all affect schedule.
PDK, NDA and GDS: What Happens Before MPW Tapeout?
Before MPW tapeout, teams need the right NDA and PDK path. GDS should come later, after process fit and review path are confirmed.
MPW Tapeout Cost: What Drives the Quote?
MPW cost is not only about node name. Die area, process options, reticle use, packaging, probe, test and schedule all shape the quote.
Where Can Overseas Teams Start a Mature-Node MPW RFQ Before Sharing GDS?
For overseas fabless, university and industrial chip teams, a mature-node MPW RFQ can start with outline requirements before GDS or design IP is shared.
BOM Consolidation, Custom Drawing Parts and Export Logistics for Semiconductor Equipment RFQs
A procurement guide for combining BOM, drawing-to-order and export/logistics requirements into a structured RFQ.
Obsolete Part and Alternative Sourcing for Semiconductor Equipment BOMs
How procurement and engineering teams should structure RFQs for obsolete parts, approved equivalents and BOM substitutions.
製造・設計・調達したい内容をお知らせください。
MPW tapeout と製造調整、NeuroBox D P&ID-to-3D review、または engineering procurement RFQ について短い brief を送ってください。