技術インサイト
MPW フロー、PDK/NDA/GDS、package/test、P&ID、BOM context、ネイティブ SOLIDWORKS assembly に関する技術記事。
技術インサイト
MPW ノード選定: 0.35um、180nm、65nm、40nm、28nm の比較
A practical node-selection guide for mature-node MPW scoping across analog, mixed-signal, RF, BCD, high-voltage and digital prototype needs.
Smap3D 代替: P&ID からネイティブ SOLIDWORKS アセンブリへ
For teams comparing Smap3D alternatives, MST focuses on AI-assisted P&ID-to-native-SOLIDWORKS assembly generation using customer libraries and review exceptions.
P&ID to 3D Using Your Own SOLIDWORKS Part Library
Why P&ID-to-3D automation should reuse the customer's approved SOLIDWORKS library, BOM fields, naming rules and review standards.
Why AI Text-to-CAD Cannot Produce Production-Oriented SOLIDWORKS Assemblies
AI text-to-CAD can make concept geometry, but P&ID-driven equipment needs native assembly structure, mates, BOM context, part-library reuse and review exceptions.
MPW tapeout に必要な GDSII、DRC、LVS
Prepare an MPW release package with top-cell identity, DRC/LVS evidence, file checksums and a handoff manifest. Includes a practical walkthrough.
チップ tapeout の進め方: 初回シリコンのチェックリスト
A practical tapeout guide from process and PDK readiness through final GDS, data acceptance, wafer fabrication, FAB Out, packaging, test and first silicon.
チップ tapeout 費用: MPW とフルマスクの違い
Chip tapeout cost depends on node, process family, die area, MPW eligibility, package, test and schedule. Use this guide before asking for a quote.
初回シリコンに向けた MPW shuttle 完全ガイド
A complete MPW shuttle guide for first silicon: what MPW means, who uses it, what affects cost and schedule, and what to prepare before…
Engineering Value of P&ID to Native SOLIDWORKS Assembly Generation
Where P&ID-to-native-SOLIDWORKS automation can help engineering teams: repeated assemblies, BOM consistency, senior-review bottlenecks, customer variants and earlier exception visibility.
How AI Handles Symbols, BOM Context and Mates in P&ID to SOLIDWORKS
A public, non-secret explanation of how AI-assisted workflows turn P&ID symbols, tags, part libraries, BOM hints and rules into reviewable native SOLIDWORKS assembly structure.
製造・設計・調達したい内容をお知らせください。
MPW tapeout と製造調整、NeuroBox D P&ID-to-3D review、または engineering procurement RFQ について短い brief を送ってください。