技术洞察
聚焦 MPW 流程、PDK/NDA/GDS、封装测试、P&ID、BOM 上下文和原生 SOLIDWORKS 装配。
技术洞察
MPW 节点选择：0.35um、180nm、65nm、40nm 与 28nm 取舍
A practical node-selection guide for mature-node MPW scoping across analog, mixed-signal, RF, BCD, high-voltage and digital prototype needs.
Smap3D 替代方案：从 P&ID 到原生 SOLIDWORKS 装配
For teams comparing Smap3D alternatives, MST focuses on AI-assisted P&ID-to-native-SOLIDWORKS assembly generation using customer libraries and review exceptions.
P&ID to 3D Using Your Own SOLIDWORKS Part Library
Why P&ID-to-3D automation should reuse the customer's approved SOLIDWORKS library, BOM fields, naming rules and review standards.
Why AI Text-to-CAD Cannot Produce Production-Oriented SOLIDWORKS Assemblies
AI text-to-CAD can make concept geometry, but P&ID-driven equipment needs native assembly structure, mates, BOM context, part-library reuse and review exceptions.
MPW 流片的 GDSII、DRC 与 LVS 要求
Prepare an MPW release package with top-cell identity, DRC/LVS evidence, file checksums and a handoff manifest. Includes a practical walkthrough.
如何准备芯片流片：首片硅检查清单
A practical tapeout guide from process and PDK readiness through final GDS, data acceptance, wafer fabrication, FAB Out, packaging, test and first silicon.
芯片流片成本：MPW 与 full mask 的差异
Chip tapeout cost depends on node, process family, die area, MPW eligibility, package, test and schedule. Use this guide before asking for a quote.
MPW Shuttle 完整指南：从共享光罩到首片硅
A complete MPW shuttle guide for first silicon: what MPW means, who uses it, what affects cost and schedule, and what to prepare before…
Engineering Value of P&ID to Native SOLIDWORKS Assembly Generation
Where P&ID-to-native-SOLIDWORKS automation can help engineering teams: repeated assemblies, BOM consistency, senior-review bottlenecks, customer variants and earlier exception visibility.
How AI Handles Symbols, BOM Context and Mates in P&ID to SOLIDWORKS
A public, non-secret explanation of how AI-assisted workflows turn P&ID symbols, tags, part libraries, BOM hints and rules into reviewable native SOLIDWORKS assembly structure.
告诉我们你要制造、设计或采购什么。
提交一段简短说明：MPW 流片与制造协调、NeuroBox D P&ID-to-3D 评审，或工程采购 RFQ。