技术洞察
聚焦 MPW 流程、PDK/NDA/GDS、封装测试、P&ID、BOM 上下文和原生 SOLIDWORKS 装配。
技术洞察
How to Tape Out Your First ASIC Without a Foundry Account
A practical route from entity and eligibility review through NDA, PDK, run registration, signoff, final GDS acceptance and first-silicon delivery.
Where Can I Manufacture a Small Batch of Custom Chips?
Compare MPW, prototype, multi-level-mask and dedicated-wafer routes for small-batch ASICs, including process fit, delivery form, packaging and test.
旧设备 SECS/GEM 改造：回放排障与验收清单
A practical guide for legacy-tool retrofits and industrial OEMs entering semiconductor automation—covering equipment models, gateway mappings, replay evidence, responsibility boundaries and fab acceptance scenarios.
从 Prompt 到 Loop Engineering：为什么半导体 AI 需要可评审闭环
Loop engineering 比一次性 prompt 更适合半导体场景：MPW、P&ID-to-3D、BOM/RFQ 和制造数据都需要可重复、可审核、有人确认的工程闭环。
MPW Timeline: From Outline RFQ to Shuttle Planning
MPW timeline is more than a shuttle date. Screening, NDA, PDK, partner confirmation, packaging, probe, test and logistics all affect schedule.
PDK, NDA and GDS: What Happens Before MPW Tapeout?
Before MPW tapeout, teams need the right NDA and PDK path. GDS should come later, after process fit and review path are confirmed.
MPW Tapeout Cost: What Drives the Quote?
MPW cost is not only about node name. Die area, process options, reticle use, packaging, probe, test and schedule all shape the quote.
Where Can Overseas Teams Start a Mature-Node MPW RFQ Before Sharing GDS?
For overseas fabless, university and industrial chip teams, a mature-node MPW RFQ can start with outline requirements before GDS or design IP is shared.
BOM Consolidation, Custom Drawing Parts and Export Logistics for Semiconductor Equipment RFQs
A procurement guide for combining BOM, drawing-to-order and export/logistics requirements into a structured RFQ.
Obsolete Part and Alternative Sourcing for Semiconductor Equipment BOMs
How procurement and engineering teams should structure RFQs for obsolete parts, approved equivalents and BOM substitutions.
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