Noticias e insights

Insights técnicos

Artículos técnicos sobre flujo MPW, PDK/NDA/GDS, package/test, P&ID, contexto BOM y ensambles nativos de SOLIDWORKS.

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Insights técnicos

Jul 2026 Insights técnicos

How to Tape Out Your First ASIC Without a Foundry Account

A practical route from entity and eligibility review through NDA, PDK, run registration, signoff, final GDS acceptance and first-silicon delivery.

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Jul 2026 Insights técnicos

Where Can I Manufacture a Small Batch of Custom Chips?

Compare MPW, prototype, multi-level-mask and dedicated-wafer routes for small-batch ASICs, including process fit, delivery form, packaging and test.

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Jul 2026 Insights técnicos

SECS/GEM para equipos legacy: retrofit, replay y checklist de aceptación

A practical guide for legacy-tool retrofits and industrial OEMs entering semiconductor automation—covering equipment models, gateway mappings, replay evidence, responsibility boundaries and fab acceptance scenarios.

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Jun 2026 Insights técnicos

Del prompting al loop engineering: por qué la IA de semiconductores necesita ciclos revisables

Loop engineering es un marco mejor que un prompt único para MPW, P&ID-to-3D, BOM/RFQ y revisión de fabricación: cada flujo necesita ciclos repetibles con…

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Jun 2026 Insights técnicos

MPW Timeline: From Outline RFQ to Shuttle Planning

MPW timeline is more than a shuttle date. Screening, NDA, PDK, partner confirmation, packaging, probe, test and logistics all affect schedule.

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Jun 2026 Insights técnicos

PDK, NDA and GDS: What Happens Before MPW Tapeout?

Before MPW tapeout, teams need the right NDA and PDK path. GDS should come later, after process fit and review path are confirmed.

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Jun 2026 Insights técnicos

MPW Tapeout Cost: What Drives the Quote?

MPW cost is not only about node name. Die area, process options, reticle use, packaging, probe, test and schedule all shape the quote.

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Jun 2026 Insights técnicos

Where Can Overseas Teams Start a Mature-Node MPW RFQ Before Sharing GDS?

For overseas fabless, university and industrial chip teams, a mature-node MPW RFQ can start with outline requirements before GDS or design IP is shared.

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Jun 2026 Insights técnicos

BOM Consolidation, Custom Drawing Parts and Export Logistics for Semiconductor Equipment RFQs

A procurement guide for combining BOM, drawing-to-order and export/logistics requirements into a structured RFQ.

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Jun 2026 Insights técnicos

Obsolete Part and Alternative Sourcing for Semiconductor Equipment BOMs

How procurement and engineering teams should structure RFQs for obsolete parts, approved equivalents and BOM substitutions.

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