News & Insights

Technical Insights

Focused technical articles on MPW flow, PDK/NDA/GDS, package/test, P&ID, BOM context and native SOLIDWORKS assembly.

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Technical Insights

Jun 2026 Technical Insights

What Information Is Needed for an MPW RFQ?

A good MPW RFQ is not a data dump. It is a clear, non-confidential summary that lets the coordination team screen process fit, readiness,…

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Jun 2026 Technical Insights

Can You Start an MPW RFQ Without GDS?

A first MPW RFQ should protect design IP. Start with non-confidential requirements, then move to NDA, PDK and partner-confirmed review before any design detail…

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Jun 2026 Technical Insights

MPW vs Full Mask: Which Tapeout Route Should You Choose?

MPW is usually a prototype and validation route. Full mask is usually a dedicated route for mature designs, larger volumes and stronger production control.

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Jun 2026 Technical Insights

What Is MPW in Chip Tapeout?

MPW lets multiple chip projects share wafer or mask resources for prototype silicon. The first RFQ can usually start from non-confidential requirements.

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Jun 2026 Technical Insights

MPW Packaging, Wafer Probe and Test: Specify Early

Why MPW RFQs should include packaging, wafer probe, sample count, test expectations and logistics before partner quotation.

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Jun 2026 Technical Insights

Analog, BCD, High-voltage and RF MPW: Specialty-process Scoping

How to scope analog, mixed-signal, BCD, high-voltage and RF MPW requirements before NDA and partner confirmation.

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Jun 2026 Technical Insights

MPW Readiness, PDK, NDA, Cost and Timeline Guide

A practical MPW guide covering readiness, PDK/NDA path, cost factors, shuttle windows, packaging and tapeout timeline.

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Jun 2026 Technical Insights

Mature-node MPW: 0.35um to 40nm Process Scoping

Scope mature-node MPW requirements across 0.35um to 40nm, including analog, mixed-signal, RF, BCD, high-voltage and eNVM process needs.

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Jun 2026 Technical Insights

MPW RFQ Without GDS: What to Submit First

Start an MPW RFQ with outline requirements only: node, process family, die area, quantity and timeline. No GDS or design IP at intake.

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Dec 2025 Technical Insights

How Smart DOE Works for Semiconductor Equipment Commissioning

Key TakeawaySmart DOE uses Bayesian optimization and Latin hypercube sampling and is designed to reduce trial wafers by up to ~80% in modeled/offline scenarios…

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