Technical Insights
Focused technical articles on MPW flow, PDK/NDA/GDS, package/test, P&ID, BOM context and native SOLIDWORKS assembly.
Technical Insights
HHGrace MPW Alternatives When Capacity Is Constrained
Compare mature-node MPW fallback routes by preserved requirements, migration effort, evidence and fab-confirmed access—not node labels.
HHGrace MPW PDK, NDA & Overseas Onboarding
Prepare the entity, users, tools, technology scope and secure exchange path needed for HHGrace NDA and PDK onboarding review.
HHGrace MPW Cost & Quotation RFQ Brief
Build a non-confidential HHGrace MPW quotation brief before final GDS by defining scope, cost drivers, unknowns and confirmation gates.
HHGrace MPW 55nm, 90nm & 40nm Process Fit
Screen HHGrace 55nm, 90nm and 40nm candidates by devices, voltage, eFlash, BCD, RF, IP and reliability before fab review.
HHGrace MPW Schedule, Slot & Capacity Enquiry
Prepare an HHGrace MPW schedule, slot, data-in and capacity enquiry with exact timing definitions, evidence owners and fab-confirmed gates.
BCD vs eFlash vs Logic CMOS vs SiGe BiCMOS: Which Process Fits Your Chip?
An engineering comparison of BCD, embedded flash, logic CMOS and SiGe BiCMOS using device, PDK, package, test and five buyer scenarios.
Small-Batch Chip Manufacturing: Process, PDK, Packaging and Test
An end-to-end small-batch ASIC guide covering process choice, controlled PDK, design release, wafer fabrication, probe, dicing, packaging, test and qualification.
How to Choose an MPW Shuttle Run
Choose an MPW run by process and PDK fit, exact deadline meanings, price basis, minimum area, samples, package/test scope and provider confirmation.
How to Tape Out Your First ASIC Without a Foundry Account
A practical route from entity and eligibility review through NDA, PDK, run registration, signoff, final GDS acceptance and first-silicon delivery.
Where Can I Manufacture a Small Batch of Custom Chips?
Compare MPW, prototype, multi-level-mask and dedicated-wafer routes for small-batch ASICs, including process fit, delivery form, packaging and test.
Tell us what you need to manufacture, design or source.
Send a short brief for MPW tapeout and manufacturing coordination, a NeuroBox D P&ID-to-native-SOLIDWORKS review, or an engineering procurement RFQ.