HHGrace mature-node MPW shuttle RFQ intake is open
MST Singapore is now accepting non-confidential RFQ intake for 2026 HHGrace mature-node MPW shuttle schedule screening. We help overseas fabless companies, universities, research teams and industrial chip developers prepare a reviewable brief for process/node fit, NDA/PDK path, package/test scope, schedule target and formal quotation workflow. Schedule window, availability and quotation are confirmed case by case after requirement review.
MST is a mature-node MPW tapeout and manufacturing coordination desk. For 2026 HHGrace mature-node shuttle screening, MST starts with non-confidential requirements, prepares a reviewable scope, clarifies NDA/PDK and package/test assumptions, and helps qualified projects move toward partner-confirmed schedule review, quotation and next steps.
HHGrace mature-node MPW platform intake table
This is the public schedule-screening entry for 2026 HHGrace mature-node MPW RFQs through MST Singapore. It is intentionally not a public price list or guaranteed shuttle calendar: exact run window, registration deadline, GDS/data-in deadline, PDK/NDA path, availability and quotation are confirmed case by case after requirement review.
Public 2026 platform and schedule-screening view
Use this table the same way a buyer would use a public MPW schedule page: identify the likely platform, then submit a non-confidential first brief so MST can check the current schedule window and quote path.
| Node | Platform | Fit | 2026 status | What to send first | RFQ |
|---|---|---|---|---|---|
| 90nm | Low-power BCD | BCD and power-management prototype requirements where voltage class, die area, package/test and samples need review. | 2026 RFQ screening open | Node target, voltage class, die estimate, sample count, package/test assumptions and target quarter. | Start RFQ → |
| 90nm | Embedded eFlash | Embedded non-volatile memory and mixed-signal prototype RFQs that can start from a non-confidential brief. | 2026 RFQ screening open | Memory/process need, die estimate, package/test assumptions, PDK/NDA status and target quarter. | Start RFQ → |
| 55nm | SiGe BiCMOS | RF, high-speed and mixed-signal prototype screening where process fit and package/test scope must be checked first. | 2026 RFQ screening open | RF/high-speed requirement, rough die size, frequency/use context, package/test assumptions and schedule target. | Start RFQ → |
| 55nm | Low-power BCD | Low-power BCD and power-management inquiries that need node, voltage, die-area, schedule and end-use review. | 2026 RFQ screening open | Voltage class, application context, die estimate, target samples and package/test assumptions. | Start RFQ → |
| 55nm | Logic / eFlash | Logic or embedded-Flash prototype needs where MST can prepare a reviewable RFQ before design-IP exchange. | 2026 RFQ screening open | Logic/eFlash need, die estimate, package/test assumptions, PDK/NDA status and preferred tapeout window. | Start RFQ → |
| 40nm | Logic / eFlash | 40nm logic, low-power or embedded-Flash prototype routes. Partner acceptance and schedule fit are required. | 2026 RFQ screening open | Node/process need, die estimate, package/test assumptions, target quarter, country and end-use context. | Start RFQ → |
Start before you share design files
Most early MPW visitors are not ready to send a full tapeout package. MST gives four lower-risk paths: compare access routes, check readiness, build a no-GDS first brief, or submit a non-confidential RFQ for manual review.
Compare which MPW path can review the case
Use the access map when the first question is not design readiness, but which route, region, eligibility gate, NDA/PDK path and review owner can handle the request.
Open access map →Check whether the request is reviewable
Use the readiness checker when you know the target application, approximate node or process family, rough die size, samples, package/test assumptions or schedule pressure.
Open readiness checker →Generate a no-GDS RFQ brief
Use the RFQ pack builder to turn node, process family, die area, sample target, package/test assumptions, timeline and end-use context into a non-confidential first-screening brief.
Build RFQ brief → Download template ↓Submit the brief for MST screening
Send the non-confidential brief when you want MST to screen process fit, package/test scope, NDA/PDK route, eligibility context and partner-review readiness.
Submit first brief →Start with a no-GDS MPW brief.
Send node range, process family, rough die area, sample target, package/test assumptions, timeline and end-use context. MST screens readiness before sensitive design data moves.
Practical guides before you submit an MPW RFQ
Use these pages when the project is not ready for full design-data exchange, but the team needs to understand what can be reviewed first.
Start an MPW RFQ without GDS
What to prepare before sharing layout files: node, process family, die estimate, samples, package/test assumptions, timeline and NDA/PDK status.
Read answer →What drives an MPW quote?
How wafer access, shared-reticle use, die area, package, wafer probe, final test, schedule and readiness gaps affect the quote path.
Read guide →MPW timeline and shuttle planning
How an outline RFQ moves through process-fit, NDA/PDK path, partner review, shuttle planning, package, probe and sample delivery.
Read answer →Who can screen HHGrace MPW requirements?
How to prepare a non-confidential HHGrace mature-node MPW brief before final route, quotation, schedule and NDA/PDK path are confirmed.
Read answer →MPW RFQ coordination services
MST turns early mature-node prototype demand into a partner-reviewable RFQ path, with clearer scope before pricing, schedule and technical handoff discussions begin.
Structure a reviewable MPW brief
You send node range, process family, die-area estimate, sample target, timeline and intended application. MST organizes the first brief for process-fit, compliance and partner review.
Bring package, probe and test into scope
MST helps define package assumptions, wafer probe, characterization, sample quantity, reliability expectations and logistics needs early enough for a realistic RFQ.
Coordinate the next confirmed step
After the case is scoped, MST prepares the partner-review packet, clarifies NDA/PDK route requirements and coordinates the next practical step for your prototype program.
Prepare a foundry-review path before discussing capacity
For small teams, overseas companies, universities and early-stage fabless projects, the hard part is often not sending an email to a foundry. It is knowing which access gate, eligibility review, PDK/NDA route, MPW window and capacity discussion the project can enter. MST helps turn the request into a qualified review packet and partner-confirmed next step without promising slot, price or schedule before review.
Find the route that can actually be reviewed
MST helps translate a buyer request into the information a foundry or qualified partner needs first: customer context, country/end-use, node range, process family, die-area estimate, sample target, package/test assumptions, timeline and requested response.
Separate readiness issues from access issues
Some projects are blocked by design readiness, while others are blocked by eligibility, PDK/NDA route, missing process assumptions or unclear review ownership. MST identifies those gaps without asking for sensitive files at public intake.
Prepare for capacity, package and test discussion
Available MPW windows and practical capacity depend on process fit, die area, package/test needs, review timing and partner confirmation. MST keeps wafer access, package, probe, test, samples and logistics in the same first-review scope.
Return a clear partner-review packet
MST returns missing items, process-fit questions, NDA/PDK checklist, package/test checklist, risk notes and a next-step owner, so the case can move into qualified review instead of staying in an unclear email thread.
When MST is a useful first call
MST is most useful before a project is ready for full design-data exchange, when the buyer needs a disciplined way to turn an early chip idea into a reviewable MPW path.
You know the chip goal, but not the exact route
Use MST when you have an application, rough node range, process family, die-size estimate or customer deadline, but need help turning it into a reviewable MPW RFQ before design files move.
The project is more than plain digital CMOS
Analog, mixed-signal, RF, high-voltage, BCD, eNVM, sensor-interface and industrial-control ASIC ideas need process-family screening, not only a node name.
You need the prototype service chain scoped
MST helps bring package, wafer probe, characterization, sample logistics and post-MPW learning into the first review packet so the quote path is not wafer-only.
You need a path that respects geography and eligibility
For non-US, non-EU, university, design-service, startup and industrial teams, the first issue is often eligibility, NDA/PDK route, export context and commercial handoff.
How an MPW RFQ moves
A simple path from first brief to review, partner routing and commercial next steps.
Intake
High-level requirements only - node, process family, die area, volume and timeline. No GDS, netlist or RTL.
Process-fit screen
We check that your requirement maps to a real mature-node or specialty process, and flag anything that needs manual review.
PDK / NDA path
Once fit is clear, we set up the NDA and PDK path so design detail is only exchanged under agreement.
Partner confirmation
A qualified partner confirms feasibility, availability and schedule for your case - nothing is assumed up front.
Partner-confirmed next step
You receive partner-confirmed next steps, commercial assumptions, or quote path after review. No commitment is made until you proceed.
How MST moves an MPW request from brief to manufacturing review.
The service covers non-confidential intake, process and node fit, NDA/PDK preparation, package/probe/test scope, partner or fab submission coordination, quote clarification, tapeout follow-up, manufacturing progress communication and sample-delivery coordination.
Structure the first MPW requirement
Convert free-text emails or form notes into a clean RFQ brief covering node range, process family, die-area estimate, sample target, package/test assumptions, timeline and end-use context.
Prepare process and PDK questions
Map the brief against analog, mixed-signal, RF, BCD, high-voltage, sensor and eNVM patterns, then surface the partner questions needed for process fit, NDA route and PDK access.
Scope the full prototype path
Turn die size, pad count, package preference, probe needs, characterization goals and sample logistics into a package/probe/test checklist before the RFQ is routed.
Create a partner-ready decision packet
Summarize open gaps, inconsistent assumptions, schedule risks and commercial questions so MST can route the case and return a clearer next step.
Coverage
Indicative process window. Final node and process are confirmed case by case with a qualified partner.
Useful tools for MPW planning
Use these tools before submitting an RFQ: plan shared-reticle floorplans, estimate gross/good dies, inspect local GDS metadata, compare cost share, and turn high-level parameters into an RFQ link. Everything runs in your browser; the GDS tool does not upload files, and RFQ intake still uses non-confidential summaries only.
See all tools →3-step MPW fit-check
Answer high-level process, prototype-scope and compliance-boundary questions, then open the MPW RFQ form with non-confidential answers pre-filled.
Open readiness check →MPW Reticle & Wafer Planner
Pack several projects into one shared reticle, step it across the wafer, estimate gross/good dies and each project area-based cost share.
Open planner →MPW Prototype Cost Estimator
Estimate gross dies per wafer, shared-reticle utilization, indicative mature-node cost range, shuttle timing and tapeout readiness.
Open estimator →Local GDSII Inspector
Inspect a .gds file fully in your browser: top cell, die size, layers, cell tree and element counts. Nothing is uploaded - use the metadata to build a non-confidential RFQ summary.
Open GDS inspector →Non-Western MPW Access Map
A neutral, sourced comparison of MPW routes - MOSIS, Europractice, Muse, IMEC and others - focused on the question others omit: which route a non-US / non-EU team can actually use. Eligibility, pricing model and access gates, every figure dated to its source.
Open access map →MPW is one part of the prototype silicon service chain
Many overseas teams do not only need a wafer run. They also need packaging, wafer probe, final-test planning, sample logistics and procurement support scoped early enough for a realistic RFQ.
Turn a vague manufacturing question into a reviewable RFQ
We help structure node range, process family, rough die area, sample count, target timing and end-use context before any confidential design exchange.
Scope packaging, wafer probe and characterization needs
Package assumption, die size, pad count, sample quantity, test coverage and reliability expectations should be visible before a formal quote path is requested.
Confirm route, price, schedule and limits case by case
MST coordinates the RFQ route, but final capability, commercial terms, timeline and acceptance criteria require qualified-partner confirmation.
Coordinate commercial steps, samples and sourcing needs
After a route is confirmed, MST can support PI/payment coordination, sample shipment communication and adjacent BOM, test accessory or small-batch sourcing requests.
MPW guides and examples
Practical guides for engineers and procurement teams preparing a reviewable MPW brief before a full tapeout package is ready.
MST launches mature-node MPW RFQ coordination
The formal service announcement for MST mature-node MPW RFQ qualification, service-chain coordination and partner-routing support.
Read announcement →MPW RFQ without GDS
What to submit first: node, process family, die area, quantity and timeline - no design IP at intake.
Read guide →0.35um-40nm mature-node scoping
How to describe node range, specialty process options and partner-confirmed feasibility.
Read guide →Readiness, PDK, NDA, cost and timeline
A practical checklist from outline RFQ to NDA/PDK path, cost drivers and shuttle planning.
Read guide →Analog, BCD, high-voltage and RF MPW
How to scope voltage, RF, passives, BCD, package and test needs before partner review.
Read guide →Packaging, wafer probe and test
Why probe, package, sample quantity, reliability and logistics belong in the first RFQ.
Read guide →Detailed MPW guides
Use these focused articles to prepare a reviewable, non-confidential MPW brief before any design IP or GDS handoff.
Where Can Overseas Teams Start a Mature-Node MPW RFQ Before Sharing GDS?
A practical first-step guide for non-US, non-EU, university, design-service and industrial chip teams that need a safe outline-first MPW path.
Read guide →Multi-Project Wafer (MPW) Shuttle: Complete Guide for First Silicon
The broad primer for shared-reticle MPW, first silicon planning, design handoff and non-confidential intake boundaries.
Read guide →What Is MPW in Chip Tapeout?
A concise answer for teams learning how shared-wafer prototype silicon differs from a dedicated production mask route.
Read guide →MPW vs Full Mask: Which Tapeout Route Should You Choose?
A decision guide comparing prototype learning, cost, schedule control, design maturity and later production readiness.
Read guide →How Much Does Chip Tapeout Cost? MPW vs Full Mask Cost Drivers
How mask set, die size, wafer quantity, packaging, probe and schedule assumptions change early cost conversations.
Read guide →MPW Tapeout Cost: What Drives the Quote?
A more RFQ-focused cost guide covering node, process options, die area, shared-reticle utilization, package, probe, test and schedule.
Read guide →How to Tapeout a Chip: First Silicon Checklist
A first-silicon checklist covering specification, PDK/NDA path, verification, GDS/OASIS readiness and RFQ scope.
Read guide →PDK, NDA and GDS: What Happens Before MPW Tapeout?
Why the first RFQ should not require design files, and how high-level screening should precede controlled PDK and GDS exchange.
Read guide →MPW Timeline: From Outline RFQ to Shuttle Planning
A schedule map from outline RFQ, process-fit and NDA/PDK path to shuttle planning, wafer run, package, probe, test and logistics.
Read guide →How MST Prepares a Foundry-Review Packet for Mature-Node MPW
The structured non-confidential packet MST prepares before qualified partner review, including process fit, NDA/PDK path, package/test scope and requested response.
Read guide →Asia Mature-Node MPW RFQ Path: What Can Be Discussed Before NDA?
A safe disclosure guide for Asia mature-node RFQs: what can be discussed publicly and what waits for NDA and partner-confirmed route review.
Read guide →MPW Readiness Report Example: What MST Checks Before Partner Review
A sample report structure for intake completeness, process fit, NDA/PDK path, package/test scope, compliance context and next-step scoring.
Read guide →MPW Readiness Checker: What to Review Before Partner RFQ
How to use MST's readiness checker to turn an early prototype request into a structured gap list before partner RFQ.
Read guide →MPW RFQ Pack Builder: How to Prepare a No-GDS First Brief
A practical guide to preparing a non-confidential MPW first brief covering process, die area, package, test, timeline and end use.
Read guide →GDS/OASIS Handoff Manifest: What to Inventory Before Controlled Delivery
What to inventory before controlled GDS/OASIS delivery after NDA, PDK context and route instructions are clear.
Read guide →PDK and Foundry Requirement Checklist Before MPW Review
How to separate public planning questions from NDA-gated PDK, DRC/LVS, package/test and route-review requirements.
Read guide →MPW Prototype Estimator: Die Count, Cost Drivers and RFQ Readiness
How to interpret early die-count and cost-driver estimates before partner-confirmed MPW review.
Read guide →Sample MPW Readiness Report for a 180nm Mixed-Signal Prototype
An illustrative, non-confidential sample report showing readiness score, process-fit questions, package/test gaps and next steps.
Read guide →Sample Foundry-Review Packet for Mature-Node MPW
An illustrative, non-confidential partner-review packet covering customer context, process request, package/test scope and requested response.
Read guide →Sample No-GDS MPW RFQ Brief: What to Send First
A public-intake example showing what overseas teams can send first without sharing GDS, PDK files or design IP.
Read guide →GDSII, DRC and LVS Requirements for MPW Tapeout
What design-rule checks and layout handoff items matter later, while MST intake still begins without design IP.
Read guide →Sky130 and Open-Source Silicon MPW Options After eFabless
A context guide for open-source silicon routes and how they differ from partner-confirmed commercial MPW review.
Read guide →Asia MPW Access: What Overseas Fabless Teams Should Prepare
Preparation notes for overseas teams comparing Asia-friendly MPW routes, documentation and partner access gates.
Read guide →MOSIS and Europractice Alternatives for Non-US and Non-Academic Teams
A practical comparison frame for teams that may not fit US, EU or university-focused shuttle access programs.
Read guide →MPW Node Selection: 0.35um, 180nm, 65nm, 40nm and 28nm Tradeoffs
How to frame mature-node and advanced-edge requests before a partner confirms real process fit and schedule.
Read guide →From MPW to Engineering Run and Mass Production
What changes after first silicon, including validation, package/test planning, engineering runs and production risk.
Read guide →FPGA to ASIC: When a Prototype Should Move Toward MPW
A decision guide for teams moving from programmable prototypes toward ASIC feasibility and first-silicon planning.
Read guide →How Many Dies Do You Get from an MPW Shuttle?
How wafer diameter, reticle use, die size, scribe lanes, yield assumptions and packaging needs affect die counts.
Read guide →How MPW projects really move from idea to first silicon.
Use this overview to understand the MPW service chain before asking for price, schedule or partner routing.
The MPW chain has more than a wafer run
A real prototype path usually moves through requirement brief, process fit, NDA/PDK route, design signoff, shuttle schedule, tapeout package, wafer run, dicing, packaging, wafer probe, final test, sample logistics and first-silicon learning.
The middle layer removes ambiguity
MST's value is to turn an unclear manufacturing request into a reviewable brief, identify missing scope, prepare partner questions, coordinate commercial steps and keep package/test/logistics visible from the beginning.
The bottlenecks are usually outside the wafer price
Common bottlenecks include unclear process fit, PDK/NDA access, late package/test planning, missing die or pad assumptions, schedule uncertainty, eligibility gates, cross-border payment and sample logistics.
Preparation tools work best before and after partner review
Preparation tools can normalize RFQ input, ask missing process questions, score quote readiness, build package/test checklists, summarize partner-review packets and organize post-MPW test evidence for the next engineering run.
Commercial scope depends on project work
A reviewed MPW path may include RFQ screening, technical coordination, document preparation, package/test/sourcing coordination, partner routing and project follow-up. The scope is confirmed case by case.
Pain points MST helps clarify
Many teams still struggle to compare eligibility, real total cost, package/test options, schedule risk and safe no-IP intake across routes. MST helps turn those questions into a clearer first RFQ path.
What a reviewable MPW packet looks like
These are illustrative, non-confidential examples. They show the level of scope MST needs for first screening and what remains for NDA-controlled review.
180nm mixed-signal sensor ASIC
Customer provides: Customer provides target node range, analog/mixed-signal function, rough die area, sample count, package preference, measurement goal and end-use context.
MST returns: MST returns missing questions, possible process-family fit, package/probe/test checklist, NDA/PDK route notes and partner-review readiness.
Later controlled path: GDS, schematics, netlist, PDK files and detailed circuit implementation stay out of the public intake and move only after the controlled path is clear.
350nm high-voltage / BCD prototype
Customer provides: Customer provides voltage class, device-option assumptions, pad/package direction, die-size range, safety or industrial-control use case, target samples and timeline.
MST returns: MST flags process-fit uncertainty, required partner questions, packaging and reliability assumptions, compliance context and quote-readiness gaps.
Later controlled path: Exact device stack, proprietary circuit detail, layout files and partner-specific design rules wait for NDA/PDK and qualified technical review.
65/55nm RF or eNVM feasibility inquiry
Customer provides: Customer provides RF band or memory need at a non-confidential level, acceptable node range, rough die area, package/test assumptions and schedule pressure.
MST returns: MST separates public planning questions from NDA-gated questions and prepares a partner-review packet focused on feasibility, access path and missing assumptions.
Later controlled path: Model files, IP blocks, proprietary layout, performance-sensitive schematics and process-specific data belong in the later controlled exchange.
Prepare your first MPW brief
A strong first brief is specific enough for process-fit screening while keeping sensitive design data for the controlled review path.
Include the facts that make routing possible
- Target node or range, such as 180nm BCD, 350nm high-voltage, 65/55nm RF, or not sure.
- Process family, estimated die-area range, target tapeout window and prototype sample quantity.
- Packaging, wafer probe, characterization, sample destination and end-use context.
- PDK/NDA status and whether you need partner-confirmed next steps before sharing design details.
Move design detail after the review path is clear
- GDS, OASIS, netlists, RTL, source code, PDK files and proprietary schematics belong in the later NDA-controlled path.
- Exact slot availability, schedule and price are reviewed against a scoped case instead of guessed from a one-line request.
- Export, customer, country and end-use context should be visible early so the right review route is selected.
- If you only know the target application and rough node, MST can help turn that into the first checklist.
A credible MPW desk protects the first conversation.
The goal is to make early review easier without asking buyers to expose sensitive design assets too soon. These are the public operating boundaries behind MST MPW coordination.
Frequently asked
The questions engineers and procurement teams ask before submitting a brief.
Ready to scope your run?
Send node, process family, die area, sample quantity and timeline - no design IP. MST prepares the request for review and moves sensitive files only through the proper NDA-controlled path.