Mature-node MPW coordination & RFQ screening
MST helps overseas fabless companies, universities, research teams, and industrial chip developers start mature-node MPW discussions with a high-level, non-confidential brief. We screen process fit, clarify the NDA/PDK path, coordinate packaging/test RFQ needs, route qualified cases to partners, and return partner-confirmed next steps.
MST is a purpose-built MPW RFQ coordination path for teams exploring mature-node prototype silicon. It starts with non-confidential requirements, screens process fit and compliance, clarifies the NDA/PDK route, and routes qualified cases to partner-confirmed next steps. MST is not a wafer foundry and does not accept GDS at intake.
Source: Moore Solution Technology · mst-sg.comWhat this is - and what it is not.
MST is not a wafer foundry and does not claim to manufacture wafers directly. We act as an MPW RFQ qualification, service-chain coordination, and partner-routing layer for mature-node prototype demand.
We coordinate, screen and scope
You send a high-level requirement. We run compliance and process-fit screening, clarify the PDK/NDA path, scope packaging/test needs, confirm feasibility with a qualified partner, and return partner-confirmed next steps.
We do not sell or guarantee slots
We do not operate a wafer fab or own wafer capacity. Availability, pricing and schedule are confirmed case by case with a qualified partner only after review.
How an MPW RFQ moves
Five steps from a high-level brief to a partner-confirmed indicative quote - manual review first, design IP last.
Intake
High-level requirements only - node, process family, die area, volume and timeline. No GDS, netlist or RTL.
Process-fit screen
We check that your requirement maps to a real mature-node or specialty process, and flag anything that needs manual review.
PDK / NDA path
Once fit is clear, we set up the NDA and PDK path so design detail is only exchanged under agreement.
Partner confirmation
A qualified partner confirms feasibility, availability and schedule for your case - nothing is assumed up front.
Indicative quote
You receive an indicative quote with partner-confirmed terms. No commitment is made until you proceed.
Where AI helps across the MPW service chain.
MST uses the MPW RFQ Agent as a planning and qualification layer, not as a claim of wafer capacity. AI structures inputs, flags gaps and prepares reviewable work products; partner confirmation still decides process access, schedule, price, packaging, wafer probe and test scope.
RFQ intake: from free-text request to structured brief
AI use: AI reads the customer email or form answers and extracts node range, process family, die-area estimate, sample quantity, package/test assumptions, timeline, country and end-use context.
Improves: It reduces first-round back-and-forth, flags missing fields, and keeps GDS, RTL, netlists and confidential IP out of the public intake.
Traditional difference: Traditional intake depends on manual triage of scattered emails; MST starts with a structured, non-confidential brief that is easier for compliance and partner review.
Process-fit: turn requirements into review questions
AI use: AI compares the brief against mature-node fit patterns such as analog, mixed-signal, RF, BCD, high-voltage, sensor and eNVM, then highlights contradictions or missing process details.
Improves: It gives the reviewer a better first read: likely process families, uncertainty points, and the exact questions a partner must answer.
Traditional difference: Traditional RFQ routing often relies on a salesperson guessing the right path; MST uses AI to prepare evidence for human and partner confirmation, not to pretend capacity is confirmed.
Packaging and test: avoid the wafer-only quote trap
AI use: AI turns die size, pad count, sample purpose, operating conditions, package preference, probe needs and characterization goals into a package/probe/test checklist.
Improves: It exposes cost and schedule drivers earlier, so the quote path includes packaging, wafer probe and test assumptions instead of only wafer access.
Traditional difference: Traditional MPW conversations often discover package/test gaps after foundry discussion; MST brings those assumptions into the first review package.
NDA and PDK path: separate public planning from design data
AI use: AI classifies questions into public planning items, NDA-gated items, PDK-access items, export-review items and customer legal-approval items.
Improves: It lowers the chance that a team shares controlled files too early and makes the next safe action clear before design detail moves.
Traditional difference: Traditional email threads mix public questions and sensitive design details; MST keeps the intake clean until the right agreement and partner path exist.
Quote-readiness: create a partner-review package
AI use: AI scores the RFQ for completeness and summarizes unresolved gaps, inconsistent assumptions, schedule risks, compliance holds and package/test unknowns.
Improves: It produces a concise reviewer packet so MST and the partner can focus on feasibility, commercial terms and next-step confirmation.
Traditional difference: Traditional RFQs arrive as long email chains; MST turns them into a scoped decision packet before asking a partner for confirmation.
After MPW: convert first-silicon learning into the next plan
AI use: AI organizes characterization notes, package/test results, yield observations, failure modes, sourcing needs and engineering-run open items after first silicon.
Improves: It helps the team decide whether the next step is another MPW, an engineering run, package/test change, BOM sourcing, or production-readiness review.
Traditional difference: Traditional handoff loses learning across emails and spreadsheets; MST keeps the post-MPW evidence connected to the next RFQ or engineering-run discussion.
Coverage
Indicative process window. Final node and process are confirmed case by case with a qualified partner.
Useful tools for MPW planning
Use these tools before submitting an RFQ: plan shared-reticle floorplans, estimate gross/good dies, inspect local GDS metadata, compare cost share, and turn high-level parameters into an RFQ link. Everything runs in your browser; the GDS tool does not upload files, and RFQ intake still uses non-confidential summaries only.
See all tools →3-step MPW fit-check
Answer high-level process, prototype-scope and compliance-boundary questions, then open the MPW RFQ form with non-confidential answers pre-filled.
Open readiness check →MPW Reticle & Wafer Planner
Pack several projects into one shared reticle, step it across the wafer, estimate gross/good dies and each project area-based cost share.
Open planner →MPW Prototype Cost Estimator
Estimate gross dies per wafer, shared-reticle utilization, indicative mature-node cost range, shuttle timing and tapeout readiness.
Open estimator →Local GDSII Inspector
Inspect a .gds file fully in your browser: top cell, die size, layers, cell tree and element counts. Nothing is uploaded - use the metadata to build a non-confidential RFQ summary.
Open GDS inspector →Non-Western MPW Access Map
A neutral, sourced comparison of MPW routes - MOSIS, Europractice, Muse, IMEC and others - focused on the question others omit: which route a non-US / non-EU team can actually use. Eligibility, pricing model and access gates, every figure dated to its source.
Open access map →MPW is one part of the prototype silicon service chain
Many overseas teams do not only need a wafer run. They also need packaging, wafer probe, final-test planning, sample logistics and procurement support scoped early enough for a realistic RFQ.
Turn a vague manufacturing question into a reviewable RFQ
We help structure node range, process family, rough die area, sample count, target timing and end-use context before any confidential design exchange.
Scope packaging, wafer probe and characterization needs
Package assumption, die size, pad count, sample quantity, test coverage and reliability expectations should be visible before a formal quote path is requested.
Confirm route, price, schedule and limits case by case
MST coordinates the RFQ route, but final capability, commercial terms, timeline and acceptance criteria require qualified-partner confirmation.
Coordinate commercial steps, samples and sourcing needs
After a route is confirmed, MST can support PI/payment coordination, sample shipment communication and adjacent BOM, test accessory or small-batch sourcing requests.
MPW knowledge tree
Focused guides for the long-tail questions engineers and procurement teams search before they are ready to submit a full tapeout package.
MST launches mature-node MPW RFQ coordination
The formal service announcement: MST is an MPW RFQ qualification and coordination partner, not a wafer foundry.
Read announcement →MPW RFQ without GDS
What to submit first: node, process family, die area, quantity and timeline - no design IP at intake.
Read guide →0.35um-40nm mature-node scoping
How to describe node range, specialty process options and partner-confirmed feasibility.
Read guide →Readiness, PDK, NDA, cost and timeline
A practical checklist from outline RFQ to NDA/PDK path, cost drivers and shuttle planning.
Read guide →Analog, BCD, high-voltage and RF MPW
How to scope voltage, RF, passives, BCD, package and test needs before partner review.
Read guide →Packaging, wafer probe and test
Why probe, package, sample quantity, reliability and logistics belong in the first RFQ.
Read guide →MPW guide cluster
Start with the pillar guide, then use these focused articles to prepare a reviewable, non-confidential MPW brief before any design IP or GDS handoff.
Multi-Project Wafer (MPW) Shuttle: Complete Guide for First Silicon
The broad primer for shared-reticle MPW, first silicon planning, design handoff and non-confidential intake boundaries.
Read guide →How Much Does Chip Tapeout Cost? MPW vs Full Mask Cost Drivers
How mask set, die size, wafer quantity, packaging, probe and schedule assumptions change early cost conversations.
Read guide →How to Tapeout a Chip: First Silicon Checklist
A first-silicon checklist covering specification, PDK/NDA path, verification, GDS/OASIS readiness and RFQ scope.
Read guide →GDSII, DRC and LVS Requirements for MPW Tapeout
What design-rule checks and layout handoff items matter later, while MST intake still begins without design IP.
Read guide →Sky130 and Open-Source Silicon MPW Options After eFabless
A context guide for open-source silicon routes and how they differ from partner-confirmed commercial MPW review.
Read guide →MPW Singapore and Asia Access: What Overseas Fabless Teams Should Prepare
Preparation notes for overseas teams comparing Asia-friendly MPW routes, documentation and partner access gates.
Read guide →MOSIS and Europractice Alternatives for Non-US and Non-Academic Teams
A practical comparison frame for teams that may not fit US, EU or university-focused shuttle access programs.
Read guide →MPW Node Selection: 0.35um, 180nm, 65nm, 40nm and 28nm Tradeoffs
How to frame mature-node and advanced-edge requests before a partner confirms real process fit and schedule.
Read guide →From MPW to Engineering Run and Mass Production
What changes after first silicon, including validation, package/test planning, engineering runs and production risk.
Read guide →FPGA to ASIC: When a Prototype Should Move Toward MPW
A decision guide for teams moving from programmable prototypes toward ASIC feasibility and first-silicon planning.
Read guide →How Many Dies Do You Get from an MPW Shuttle?
How wafer diameter, reticle use, die size, scribe lanes, yield assumptions and packaging needs affect die counts.
Read guide →What we do / what we do not
Clear scope, no surprises. The boundary is the same boundary that protects your design IP.
- Take a high-level MPW brief and run customer, country and end-use screening.
- Screen process-fit against mature-node and specialty processes.
- Set up the NDA and PDK path before any design detail is exchanged.
- Coordinate with a qualified partner to confirm feasibility and schedule.
- Return an indicative quote with partner-confirmed terms.
- We do not operate a wafer fab or manufacture wafers directly.
- We do not sell, reserve or guarantee wafer capacity or foundry slots.
- We do not accept GDS, netlist or RTL at intake.
- We do not promise availability, pricing or schedule before partner confirmation.
- We do not bypass export screening or compliance review.
Good vs bad MPW RFQ submissions
A reviewable RFQ is specific enough for process-fit screening, but still non-confidential. If you are not sure, start with the safe version below.
Good first RFQ
- Target node or range, such as 180nm BCD, 350nm high-voltage, 65/55nm RF, or not sure.
- Process family, estimated die-area range, target tapeout window and prototype sample quantity.
- Packaging, wafer probe, characterization, sample destination and end-use context.
- PDK/NDA status and whether you need partner-confirmed next steps before sharing design details.
Do not submit these at intake
- GDS, OASIS, netlists, RTL, source code, PDK files, proprietary layout or confidential schematics.
- Requests for guaranteed foundry slots, reserved capacity, fixed price or fixed shuttle schedule.
- Any request to bypass export screening, customer review, country review or end-use review.
- Unclear messages such as "please tape out my chip" without node, process, package/test or timing context.
Frequently asked
The questions engineers and procurement teams ask before submitting a brief.
Ready to scope your run?
Send node, process family, die area, volume and timeline - no design IP. We screen it, route to a qualified partner, and return an indicative quote.