Technical Insights
Focused technical articles on MPW flow, PDK/NDA/GDS, package/test, P&ID, BOM context and native SOLIDWORKS assembly.
Technical Insights
P&ID to SOLIDWORKS Assembly: Feature Tree vs STEP Export
Why native SOLIDWORKS assemblies with feature tree, mates, BOM context and reusable parts are more useful than neutral geometry export for P&ID-driven equipment design.
What Information Is Needed for an MPW RFQ?
A good MPW RFQ is not a data dump. It is a clear, non-confidential summary that lets the coordination team screen process fit, readiness,…
Can You Start an MPW RFQ Without GDS?
A first MPW RFQ should protect design IP. Start with non-confidential requirements, then move to NDA, PDK and partner-confirmed review before any design detail…
MPW vs Pilot Wafer vs Full Mask: Which Route Fits Your Chip?
A practical decision guide to shared MPW, pilot wafer or engineering lots, and dedicated full-mask production—covering maturity, schedule, splits, samples, package, test and scale-up.
What Is MPW in Semiconductor? Tapeout to First Silicon
MPW combines multiple chip designs on a shared wafer run. Learn when it fits, what affects cost and schedule, and what to prepare before…
MPW Packaging, Wafer Probe and Test: Specify Early
Why MPW RFQs should include packaging, wafer probe, sample count, test expectations and logistics before partner quotation.
Analog, BCD, High-voltage and RF MPW: Specialty-process Scoping
How to scope analog, mixed-signal, BCD, high-voltage and RF MPW requirements before NDA and partner confirmation.
MPW Readiness, PDK, NDA, Cost and Timeline Guide
A practical MPW guide covering readiness, PDK/NDA path, cost factors, shuttle windows, packaging and tapeout timeline.
Mature-node MPW: 0.35um to 40nm Process Scoping
Scope mature-node MPW requirements across 0.35um to 40nm, including analog, mixed-signal, RF, BCD, high-voltage and eNVM process needs.
MPW RFQ Without GDS: What to Submit First
Start an MPW RFQ with outline requirements only: node, process family, die area, quantity and timeline. No GDS or design IP at intake.
Tell us what you need to manufacture, design or source.
Send a short brief for MPW tapeout and manufacturing coordination, a NeuroBox D P&ID-to-native-SOLIDWORKS review, or an engineering procurement RFQ.