公司新闻、行业动态与技术洞察。
查看 MST 的公司发展、产品发布、行业解读，以及面向 MPW、半导体设备设计 和 RFQ 准备 的实用技术文章。
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公司新闻
MST 最新发展与发布
Moore Solution Technology 的公司动态、服务上线、公开资源和产品发布信息。
行业动态
市场与供应链观察
围绕成熟制程 MPW、亚洲准入、设备设计趋势和半导体供应链变化的实用解读。
技术洞察
工程指南与专业解释
聚焦 MPW 流程、PDK/NDA/GDS、封装测试、P&ID、BOM 上下文和原生 SOLIDWORKS 装配。
产品更新
工具与服务更新
MST MPW 工具、NeuroBox D 评审流程和 RFQ 准备资源的更新说明。
从 MPW 到工程批与量产：首片硅之后发生什么
First silicon is not the finish line. Learn how MPW results should feed packaging, characterization, engineering run and production planning.
MPW 节点选择：0.35um、180nm、65nm、40nm 与 28nm 取舍
A practical node-selection guide for mature-node MPW scoping across analog, mixed-signal, RF, BCD, high-voltage and digital prototype needs.
非欧美团队的 MOSIS 与 Europractice 替代路径
How to think about MPW routes when a team is outside the usual US, European or academic shuttle paths.
新加坡与亚洲 MPW 入口：海外团队应准备什么
How overseas fabless, university and research teams can prepare a non-confidential MPW access brief before discussing nodes, PDK, NDA, packaging and logistics.
Smap3D 替代方案：从 P&ID 到原生 SOLIDWORKS 装配
For teams comparing Smap3D alternatives, MST focuses on AI-assisted P&ID-to-native-SOLIDWORKS assembly generation using customer libraries and review exceptions.
P&ID to 3D Using Your Own SOLIDWORKS Part Library
Why P&ID-to-3D automation should reuse the customer's approved SOLIDWORKS library, BOM fields, naming rules and review standards.
Why AI Text-to-CAD Cannot Produce Production-Oriented SOLIDWORKS Assemblies
AI text-to-CAD can make concept geometry, but P&ID-driven equipment needs native assembly structure, mates, BOM context, part-library reuse and review exceptions.
eFabless 之后的 Sky130 与开源硅 MPW 选项
How Sky130, TinyTapeout-style and open-source silicon teams should evaluate MPW route fit, PDK dependency, DRC/LVS status, package and eligibility.
MPW 流片的 GDSII、DRC 与 LVS 要求
Prepare an MPW release package with top-cell identity, DRC/LVS evidence, file checksums and a handoff manifest. Includes a practical walkthrough.
如何准备芯片流片：首片硅检查清单
A practical tapeout guide from process and PDK readiness through final GDS, data acceptance, wafer fabrication, FAB Out, packaging, test and first silicon.
Related tools
MPW RFQ 包生成器
Turn node, process family, die area, package/test assumptions, timeline and end-use context into a non-confidential first-screen brief.
P&IDP&ID Assembly Intake Checklist
Collect diagram quality, tag index, BOM, part library and rule context before asking whether a native SOLIDWORKS assembly pilot is realistic.
寻源BOM RFQ 规范化工具
Normalize messy BOM rows and expose missing manufacturer, quantity, drawing or description fields before supplier outreach.
告诉我们你要制造、设计或采购什么。
提交一段简短说明：MPW 流片与制造协调、NeuroBox D P&ID-to-3D 评审，或工程采购 RFQ。