新闻与洞察。
公司动态、产品发布和面向搜索的寻源指南 - 覆盖零部件、BOM、材料和成熟制程 MPW，由新加坡协调。
Can You Start an MPW RFQ Without GDS?
A first MPW RFQ should protect design IP. Start with non-confidential requirements, then move to NDA, PDK and partner-confirmed review before any design detail…
MPW vs Full Mask: Which Tapeout Route Should You Choose?
MPW is usually a prototype and validation route. Full mask is usually a dedicated route for mature designs, larger volumes and stronger production control.
What Is MPW in Chip Tapeout?
MPW lets multiple chip projects share wafer or mask resources for prototype silicon. Overseas teams can start feasibility screening with high-level RFQ details before…
MPW 聚合服务正式开启：MST 提供成熟制程流片 RFQ 协调
MST 已开启成熟制程 MPW 需求聚合与 RFQ 协调服务。MST 不是晶圆厂；初次提交只需概要需求，不接收 GDS 或设计 IP。
MPW 流片报价：成熟制程 MPW 需要先准备什么？
中文 MPW 流片报价指南：成熟制程 MPW、是否需要 GDS、PDK/NDA、封装测试、时间线和合规初筛。
MPW Packaging, Wafer Probe and Test: Specify Early
Why MPW RFQs should include packaging, wafer probe, sample count, test expectations and logistics before partner quotation.
Analog, BCD, High-voltage and RF MPW: Specialty-process Scoping
How to scope analog, mixed-signal, BCD, high-voltage and RF MPW requirements before NDA and partner confirmation.
MPW Readiness, PDK, NDA, Cost and Timeline Guide
A practical MPW guide covering readiness, PDK/NDA path, cost factors, shuttle windows, packaging and tapeout timeline.
Mature-node MPW: 0.35um to 40nm Process Scoping
Scope mature-node MPW requirements across 0.35um to 40nm, including analog, mixed-signal, RF, BCD, high-voltage and eNVM process needs.
MPW RFQ Without GDS: What to Submit First
Start an MPW RFQ with outline requirements only: node, process family, die area, quantity and timeline. No GDS or design IP at intake.
MST Industrial Store Is Live: RFQ-Based Sourcing and Mature-Node MPW Tapeout Coordination
MST Industrial Store is live for overseas industrial buyers, with RFQ-based sourcing, drawing and BOM services, and mature-node MPW tapeout coordination.
How AI Lands in Semiconductor Fabs: A Practical Roadmap
Key Takeaway AI adoption in semiconductor fabs follows a clear 3-step pattern: start with VM, then add R2R, then EIP. Most failures happen from…