Sample Foundry-Review Packet for Mature-Node MPW
A sample foundry-review packet shows how MST converts an early MPW request into a concise decision packet for qualified partner review.
- →Answer-first summary
- →Sample packet header
- →Executive summary
- →Technical brief
- →Readiness gaps
Answer-first summary
A foundry-review packet converts an early MPW request into a concise decision document for qualified partner review. It should summarize customer context, end use, process request, die estimate, sample target, package/test assumptions, PDK/NDA status, missing fields, risk flags and the specific response being requested. It should not expose design IP at public intake.
This sample is fictional and non-confidential. It shows how MST can structure an MPW case before route-specific details, pricing, schedule or sensitive files are discussed.
Sample packet header
| Packet type | Mature-node MPW partner-review packet |
|---|---|
| Prepared by | MST MPW RFQ coordination desk |
| Disclosure level | Non-confidential first-review brief |
| Requested response | Process-fit and route-screening feedback; NDA/PDK path guidance if suitable |
Executive summary
Customer is evaluating a mature-node prototype for a commercial industrial-control application. Target process range is 0.18um to 0.13um, with analog/mixed-signal capability and possible high-voltage devices. Die estimate is preliminary. The customer needs packaged samples for bring-up and characterization. Public intake contains no GDS, RTL, netlist, source code, PDK file or proprietary IP.
Technical brief
Process request
- Target node range: 0.18um to 0.13um
- Process family: analog/mixed-signal, high-voltage option under review
- Special devices: to be confirmed after process-fit screening
- PDK status: no route-specific PDK path identified at public intake
Prototype assumptions
- Estimated die area: 3 mm x 3 mm to 5 mm x 5 mm
- Sample target: 50 to 100 packaged devices
- Package: QFN or similar wire-bond package, pin count not final
- Probe/test: wafer-probe and final-test needs not yet defined
- Timeline: customer requests first route feedback before committing to layout release plan
Readiness gaps
| Gap | Impact | Requested clarification |
|---|---|---|
| Voltage domains incomplete | Process family may change | Customer to provide target operating voltages at category level. |
| Package not fixed | Cost, schedule and pad-ring assumptions remain open | Customer to narrow package family and pin-count estimate. |
| Probe/test scope missing | Quote path may be wafer-only if not clarified | MST to prepare package/probe/test checklist. |
| NDA/PDK path unknown | Detailed design discussion cannot proceed | Partner to indicate required NDA sequence if the case fits. |
Risk flags
- Die area is preliminary, so cost-driver discussion is indicative.
- Package/test scope is underdefined and should be clarified before quote review.
- Design data is not requested at this stage.
- Partner name, route, pricing and schedule require case-specific confirmation and permission before external use.
Requested partner response
- Does the process-family description fit any mature-node route category?
- Which additional non-confidential fields are needed before NDA discussion?
- What package/probe/test assumptions should be clarified before quote review?
- What is the correct next step if the case passes initial screening?
How to create a packet like this
Start with the MPW RFQ Pack Builder, then use the PDK / Foundry Requirement Checklist and MPW Readiness Checker to close obvious gaps before submitting an MPW RFQ intake.
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Ready to plan your MPW and first-silicon path?
Start with a non-confidential brief covering node/process fit, schedule, first-silicon validation, packaging/test, sample handling or re-spin needs. MST routes the request for review; feasibility, availability, timing and quotation are confirmed case by case.