MPW Timeline: From Outline RFQ to Shuttle Planning
MPW timeline is more than a shuttle date. Screening, NDA, PDK, partner confirmation, packaging, probe, test and logistics all affect schedule.
- →Step 1: outline RFQ
- →Step 2: process-fit and compliance screen
- →Step 3: NDA and PDK path
- →Step 4: partner confirmation
- →Step 5: design readiness and tapeout planning
Answer-first summary: A realistic MPW timeline includes outline RFQ, process-fit screening, compliance review, NDA/PDK route, partner confirmation, design readiness, shuttle planning, wafer run, dicing, packaging, wafer probe, final test, logistics and first-silicon learning.
When teams ask about MPW timing, they often focus on the shuttle deadline. That date matters, but it is only one part of the full timeline. A realistic MPW plan includes RFQ screening, NDA, PDK access, partner confirmation, design readiness, wafer processing, package, probe, final test, logistics and first-silicon learning.
Step 1: outline RFQ
The first step is a non-confidential RFQ brief. It should include node range, process family, estimated die area, sample quantity, package assumptions, target timeline, company country and end-use context. No GDS is needed at public intake.
This stage is where MST can help turn a vague request into a reviewable packet and identify missing assumptions before sensitive files move.
Step 2: process-fit and compliance screen
The request needs to be screened for process fit and basic compliance context. Not every project can move forward automatically. Sensitive customer, country or end-use cases may require manual review before any next step.
Step 3: NDA and PDK path
If the case is qualified, the next step is to clarify the NDA and PDK path. This is where the request moves from general discussion toward controlled technical exchange.
Teams should not wait until the last week before a shuttle deadline to ask about NDA and PDK access. These gates can be real schedule drivers.
Step 4: partner confirmation
Availability, process route, schedule, package/probe/test scope and indicative pricing must be confirmed case by case with a qualified partner. No serious MPW quote should assume route, price or timing without this step.
Step 5: design readiness and tapeout planning
The design team then needs to align with the relevant design rules, review requirements and submission schedule. Readiness issues can include layout maturity, DRC/LVS status, pad ring, ESD assumptions, package choice and test planning.
Step 6: wafer, probe, package and delivery
The wafer run is not the end of the project. Wafer probe, packaging, sample delivery, characterization and possible debug work all belong in the practical timeline.
Step 7: first-silicon learning
After MPW, the team should organize characterization results, package/test observations, yield notes, failure modes and engineering-run questions. This is where AI can help summarize evidence and connect it to the next RFQ or engineering-run discussion.
Where timelines slip
Timeline risk often appears outside the wafer run: unclear process family, late package/test definition, incomplete die or pad assumptions, missing country/end-use context, NDA/PDK delay, DRC/LVS issues, or a target date that does not leave enough review time.
FAQ
How early should I start an MPW RFQ?
Start as soon as node range, process family, approximate die area and sample needs are clear. Early screening can prevent wasted design effort.
Is the shuttle deadline the only date that matters?
No. NDA, PDK access, design readiness, partner confirmation, packaging and test can all affect the real schedule.
Can I start before final layout is complete?
Yes. The first RFQ can be outline-only. Detailed design exchange should come later under the correct review path.
Next step: If your team has a target prototype date, start with a high-level MPW RFQ now so process fit, NDA/PDK path and schedule assumptions can be screened early.
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