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MST の会社アップデート、製品リリース、業界ノート、MPW、半導体装置設計、RFQ 準備に関する実務的な技術記事を掲載します。

MPW tapeout and wafer planning visual P&ID to native SOLIDWORKS automation visual Semiconductor equipment sourcing visual

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Jun 2026 技術インサイト

MPW vs Pilot Wafer vs Full Mask: Which Route Fits Your Chip?

A practical decision guide to shared MPW, pilot wafer or engineering lots, and dedicated full-mask production—covering maturity, schedule, splits, samples, package, test and scale-up.

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Jun 2026 技術インサイト

What Is MPW? A Beginner’s Chip Tapeout Tutorial

MPW combines multiple chip designs on a shared wafer run. Learn when it fits, what affects cost and schedule, and what to prepare before…

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Jun 2026 会社ニュース

MST Launches Mature-Node MPW Aggregation and RFQ Coordination

MST has opened mature-node MPW aggregation and RFQ coordination. Start with high-level requirements only; no GDS or design IP at intake.

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Jun 2026 技術インサイト

MPW Packaging and Test Tutorial: Plan Your First Silicon

Plan MPW wafer probe, die handling, packaging and first-silicon testing with a worked sample allocation and a die-to-package checklist.

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Jun 2026 技術インサイト

Analog, BCD, High-voltage and RF MPW: Specialty-process Scoping

How to scope analog, mixed-signal, BCD, high-voltage and RF MPW requirements before NDA and partner confirmation.

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Jun 2026 技術インサイト

MPW Readiness, PDK, NDA, Cost and Timeline Guide

A practical MPW guide covering readiness, PDK/NDA path, cost factors, shuttle windows, packaging and tapeout timeline.

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Jun 2026 技術インサイト

Mature-node MPW: 0.35um to 40nm Process Scoping

Scope mature-node MPW requirements across 0.35um to 40nm, including analog, mixed-signal, RF, BCD, high-voltage and eNVM process needs.

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Jun 2026 技術インサイト

MPW RFQ Without GDS: What to Submit First

Start an MPW RFQ with outline requirements only: node, process family, die area, quantity and timeline. No GDS or design IP at intake.

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Jun 2026 会社ニュース

MST Industrial Store Is Live: RFQ-Based Sourcing and Mature-Node MPW Tapeout Coordination

MST Industrial Store is live for overseas industrial buyers, with RFQ-based sourcing, drawing and BOM services, and mature-node MPW tapeout coordination.

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Mar 2026 業界動向

How AI Lands in Semiconductor Fabs: A Practical Roadmap

Key TakeawayAI adoption in semiconductor fabs follows a clear 3-step pattern: start with VM, then add R2R, then EIP. Most failures happen from bad…

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製造・設計・調達したい内容をお知らせください。

MPW tapeout と製造調整、NeuroBox D P&ID-to-3D review、または engineering procurement RFQ について短い brief を送ってください。