会社ニュース、業界動向、技術インサイト。
MST の会社アップデート、製品リリース、業界ノート、MPW、半導体装置設計、RFQ 準備に関する実務的な技術記事を掲載します。
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会社ニュース
MST の展開とリリース
Moore Solution Technology の会社アップデート、サービス開始、公開リソース、製品リリース情報。
業界動向
市場とサプライチェーンのノート
成熟ノード MPW、アジアでのアクセス、装置設計トレンド、半導体サプライチェーン変化に関する実務的な解説。
技術インサイト
エンジニアリングガイドと解説
MPW フロー、PDK/NDA/GDS、package/test、P&ID、BOM context、ネイティブ SOLIDWORKS assembly に関する技術記事。
製品アップデート
ツールとサービスの更新
MST MPW tools、NeuroBox D review workflow、RFQ 準備リソースの更新情報。
Obsolete Part and Alternative Sourcing for Semiconductor Equipment BOMs
How procurement and engineering teams should structure RFQs for obsolete parts, approved equivalents and BOM substitutions.
Semiconductor Equipment Parts Sourcing: VCR, MFC, Valves, Seals and Vacuum Components
A sourcing guide for semiconductor equipment teams buying UHP gas, vacuum, seal and control components through structured RFQ.
MFC, VCR Fittings and Valve Layout: BOM Context for Gas Panel Automation
Why mass flow controllers, VCR fittings, valves, regulators and filters need BOM-aware part-library mapping before P&ID-to-SOLIDWORKS automation.
DriveWorks, Tacton and Rules-Based CAD Automation vs AI P&ID Assembly Generation
Where rules-based SOLIDWORKS automation fits, where CPQ/configuration tools fit, and where P&ID-driven assembly generation needs a different workflow.
As-Built Verification for P&ID and Native SOLIDWORKS Assemblies
How engineering teams can compare P&ID intent, generated assembly, revision history and as-built reality without exposing core IP in the first conversation.
P&ID vs 3D Model Check: Design Rule Validation Before SOLIDWORKS Review
How P&ID intent, BOM context and 3D assembly geometry should be cross-checked before a SOLIDWORKS assembly proposal reaches engineering review.
SEMI F82 and Surface-Mount Gas Stick Scoping: What to Verify Before CAD Automation
How to treat SEMI and surface-mount gas-stick requirements as scoping inputs for P&ID-to-native-SOLIDWORKS assembly workflows.
UHP Gas System Design Terms for P&ID to SOLIDWORKS Automation
A glossary-style guide for UHP gas system terms that matter when converting P&ID intent into reviewable native SOLIDWORKS assembly proposals.
MPW shuttle から得られる die 数の考え方
Why MPW sample count depends on die size, wafer share, yield, dicing, packaging and test choices.
FPGA から ASIC へ: プロトタイプを MPW に進める判断
How founders and engineering managers can decide whether FPGA, MPW or a dedicated ASIC route fits the product stage.
Related tools
MPW RFQパックビルダー
Turn node, process family, die area, package/test assumptions, timeline and end-use context into a non-confidential first-screen brief.
P&IDP&ID Assembly Intake Checklist
Collect diagram quality, tag index, BOM, part library and rule context before asking whether a native SOLIDWORKS assembly pilot is realistic.
調達BOM RFQ正規化ツール
Normalize messy BOM rows and expose missing manufacturer, quantity, drawing or description fields before supplier outreach.
製造・設計・調達したい内容をお知らせください。
MPW tapeout と製造調整、NeuroBox D P&ID-to-3D review、または engineering procurement RFQ について短い brief を送ってください。