MPW Readiness, PDK, NDA, Cost and Timeline Guide
A practical MPW guide covering readiness, PDK/NDA path, cost factors, shuttle windows, packaging and tapeout timeline.
- →Readiness checklist
- →PDK and NDA sequence
- →Cost and timeline drivers
- →FAQ
- →Start an MPW RFQ
Quick answer: A useful MPW plan works backward from the silicon need date and includes readiness, compliance screening, NDA, PDK access, signoff, shuttle window, wafer run, packaging and test.
A shuttle date is not the full MPW timeline. The real timeline includes everything before and after the shared wafer run, including screening, NDA, PDK access, signoff, packaging and test.
Readiness checklist
- Architecture and top-level requirements are stable enough for an outline RFQ.
- Node range, process family and process-sensitive options are known.
- Estimated die area and target sample quantity are available.
- DRC/LVS/signoff status and known risks are documented internally.
- Package, wafer probe, test and logistics assumptions are stated early.
PDK and NDA sequence
- Outline RFQ first: no GDS, no netlist, no RTL and no confidential design detail.
- Manual compliance and process-fit screening.
- Qualified partner review and case-by-case feasibility confirmation.
- NDA and PDK path before design-detail exchange.
- Indicative quote and next-step decision.
Cost and timeline drivers
- Die area, node and process family.
- Special options such as RF passives, high-voltage devices, BCD, eNVM, thick metal or package/test requirements.
- Shuttle window availability and schedule flexibility.
- Probe, packaging, reliability, sample quantity and shipping destination.
FAQ
What makes an MPW project ready for RFQ?
An MPW project is ready for RFQ when the team can describe node range, process family, die area, sample quantity, package/test assumptions, timeline and use case without disclosing confidential design files.
When should NDA and PDK access happen?
NDA and PDK access should happen after outline screening and partner routing. MST keeps intake non-confidential so design detail is exchanged only after the proper agreement path is clear.
What are the biggest MPW cost factors?
The biggest MPW cost factors are die area, node, process options, shuttle timing, packaging, wafer probe, reliability work, sample quantity and logistics. A useful quote needs enough context on all of these.
Start an MPW RFQ
Start with node range, process family, estimated die area, target quantity, packaging or test assumptions, and timeline. Do not upload GDS, netlist, RTL, schematics or confidential design files at intake.
Submit an MPW RFQ or return to the MST mature-node MPW coordination hub.
准备定义您的项目?
发送节点、工艺类型、芯片面积、数量和时间线 - 不包含设计 IP。我们筛选后对接合格伙伴,并返回初步报价。